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HY910 20gram Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for GPU LED MOSFET 3D Printer IC Chipset
High Thermal Conductivity - With a thermal conductivity rate of 0.975W/m-K, this thermal conductive glue helps disperse heat effectively from MOSFETs, LEDs, ICs, GPU chipsets, and other electronic components that require direct bonding.
HY910 20gram Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for GPU LED MOSFET 3D Printer IC Chipset
Item #: 75303834

HY910 20gram Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for GPU LED MOSFET

Item #: 75303834

ETB 2042

Price Details

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High Thermal Conductivity - With a thermal conductivity rate of 0.975W/m-K, this thermal conductive glue helps disperse heat effectively from MOSFETs, LEDs, ICs, GPU chipsets, and other electronic components that require direct bonding.
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What Stands Out

High Thermal Conductivity
Delivers superior thermal conductivity ensuring efficient heat dissipation for GPUs, MOSFETs, and more, enhancing performance and reliability in high-demand applications.
Versatile Applications
Designed for multiple uses, including 3D printers and IC chipsets, making it suitable for a wide range of electronic cooling solutions, thus addressing various user needs.
Easy Application
The silicone-based adhesive offers a user-friendly application process, ensuring a strong bond without mess, simplifying installation and maintenance for both amateurs and professionals.

Product Details

Get HY910 0.975Wm-k Thermal Conductive Glue - Perfect for LED, GPU, 3D Printer & More. Shop Now at Ubuy Ethiopia & Enjoy Fast Shipping!
  • High thermal conductivity rate of 0.975W/m-K for effective heat dispersion from electronic components
  • Non-toxic, non-electrical conductive, odorless, and moisture-resistant for safe use
  • Strong adhesion properties for reliable and long-lasting connection with metals and non-metals
  • Quick drying time of approximately 30 minutes at 25℃ for easy application
  • Wide service temperature range of -60~250 degrees Celsius for versatile use in various industries
  • Ideal for heatsinks without a fixed clip, suitable for use in electrical appliances, instruments, and more
Item Weight0.04 lbs (20 grams)

Who Should Buy?

Suitable For
  • PC Builders

    Ideal for DIY PC builders looking to ensure optimal thermal conductivity between components like GPUs and CPU coolers.

  • 3D Printer Users

    Beneficial for users of 3D printers who need reliable heat management for their printer's electronics and heating elements.

  • Electronics Repair

    Useful for technicians repairing electronics, as it facilitates efficient cooling solutions for IC chipsets and MOSFETs.

Not Suitable For
  • General Crafting

    Not suitable for general crafting or hobby projects where traditional glues or adhesives may suffice.

  • Non-Tech Users

    Less effective for users who do not engage with electronics or require adhesive for less sensitive applications.

  • Outdoor Applications

    Not ideal for outdoor use as it may not withstand extreme weather conditions or UV exposure.

Product Description

HY910 20gram Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for GPU LED MOSFET 3D Printer IC Chipset

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Customer Questions & Answers

  • Question: What is HY910 Thermal Conductive Glue used for?

    Answer: HY910 Thermal Conductive Glue is specifically designed for high-performance thermal conductivity applications. It effectively bonds components like heatsinks to GPUs, LEDs, and MOSFETs, ensuring optimal heat dissipation. This silicone-based adhesive is ideal for electronics, enhancing thermal management in devices. For example, users can apply it to GPU installations to prevent overheating, thereby ensuring stable performance during intensive gaming or computing tasks.
  • Question: How does HY910 improve heat dissipation?

    Answer: HY910 enhances heat dissipation by creating a strong thermal interface between heat-producing components and heatsinks. Its high thermal conductivity allows heat to transfer more efficiently, minimizing temperature buildup. This is particularly crucial for electronic devices that generate a lot of heat, like gaming PCs or servers, where optimal thermal management is necessary to maintain performance and prevent damage.
  • Question: Is HY910 safe for sensitive electronics?

    Answer: Yes, HY910 is safe for use with sensitive electronics. Its formulation is designed to be non-corrosive and non-conductive, which means it won't short circuit electronic components. This makes it an excellent choice for various applications in computers and other delicate electronics, ensuring that they operate reliably without risk of damage from the adhesive itself.
  • Question: How do I apply HY910 Thermal Conductive Glue?

    Answer: To apply HY910 Thermal Conductive Glue, ensure both surfaces are clean and free of dust or oil. Squeeze a small amount of the adhesive onto one part and spread it evenly before pressing the components together. Allow adequate time for curing to maximize adhesion and thermal conductivity. This method is great for fixing heatsinks to CPUs or GPUs, ensuring a solid bond for effective cooling.
  • Question: Can I remove HY910 after it has cured?

    Answer: Removing HY910 after it cures can be challenging due to its strong bond. However, if necessary, carefully use a plastic scraper to pry apart the bonded surfaces. For more effective removal, applying heat can soften the adhesive. This technique can be helpful when upgrading or replacing components in your PC, especially if you want to install a more efficient cooling solution.
  • Question: What temperature range can HY910 withstand?

    Answer: HY910 is formulated to withstand a broad temperature range, typically between -40°C to 200°C. This high thermal resistance allows it to maintain efficacy in various environments, making it suitable for both consumer electronics and industrial applications. Whether you're working on high-stress gaming systems or automotive electronics, HY910 remains stable and reliable.
  • Question: Does HY910 have a specific curing time?

    Answer: Hydrolysis of HY910 typically occurs within a few hours, with full strength achieved after 24 hours. During this time, it’s important to keep the adhesive undisturbed to ensure optimal bonding. This gradual curing process means users in scenarios like assembling new gaming systems or repairing existing setups will have a dependable adhesive that becomes more effective over time.
  • Question: Can I use HY910 for other applications apart from electronics?

    Answer: While HY910 is primarily designed for electronic applications, its high thermal conductivity and strong adhesive properties allow it to be used in various other applications, including automotive and DIY projects that require effective heat transfer and bonding. Users often find it handy for attaching heatsinks in home repairs or building custom cooling setups in personal projects.
  • Question: What is the consistency of HY910 Thermal Conductive Glue?

    Answer: HY910 Thermal Conductive Glue has a thick, paste-like consistency, making it easy to apply precisely where needed. This thickness ensures it stays in place during application and does not run or drip. It's well-suited for vertical or overhead applications, which is beneficial for users looking to bond heatsinks to vertical GPU configurations effectively.
  • Question: Where can I buy HY910 Thermal Conductive Glue in Ethiopia?

    Answer: You can purchase HY910 Thermal Conductive Glue exclusively from Ubuy in Ethiopia. Ubuy offers a reliable platform with a variety of products, ensuring you have access to this high-performance thermal adhesive for your projects. Whether you're upgrading your gaming setup or working on electronic repairs, Ubuy provides a convenient shopping experience to fulfill your needs.

Bymugo Electrically Conductive Adhesives Editorial Review

The HY910 Thermal Conductive Glue received mixed feedback from customers. One reviewer found the product to be a great solution for gluing heat sinks to an LED array's aluminum panel, resulting in improved heat transfer. On the other hand, another user faced issues with the product curing inside the tube after a single use, expressing disappointment at its limited usability. Another user mentioned that it took over a day to dry and was messy when used to install a thermal switch on a motor. Despite this, the thermal switch was still securely in place and functional. Additionally, the adhesive was praised for reducing coil whine sound in a laptop by applying it on inductors. One user also found it effective for thermally bonding LED chips to a heatsink. Although some customers were satisfied with the product's performance, others highlighted challenges such as messy application, limited usability, and slow drying time. As such, user experiences with the HY910 Thermal Conductive Glue appear to be varied.

Customer Reviews & Ratings

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Pros

  • Effective for gluing heat sinks to LED arrays and bonding LED chips to heatsinks
  • Reduces coil whine sound in laptops
  • Provides thermal stability for electronic components

Cons

  • Limited usability; may cure inside the tube after a single use

Product Price History

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