ALLSOCKET
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FBGA153 BGA153-0.5mm Burn-in Testing Socket Non-Soldering Version(Fix by Screw), Pitch 0.5mm IC Size 11.5x13mm eMMC153-0.5mm Memroy(BGA153-0.5-TP)
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FBGA153 BGA153-0.5mm Burn-in Testing Socket Non-Soldering Version(Fix by Screw), Pitch 0.5mm IC Size 11.5x13mm eMMC153-0.5mm Memroy(BGA153-0.5-TP)
FBGA153 BGA153-0.5mm Burn-in Testing Socket Non-Soldering Version(Fix by Screw), Pitch 0.5mm IC Size 11.5x13mm eMMC153-0.5mm Memroy(BGA153-0.5-TP)
Item #: 43938855

FBGA153 BGA153-0.5mm Burn-in Testing Socket Non-Soldering Version(Fix by Screw), Pitch 0.5mm IC Size 11.5x13mm eMMC153-0.5mm Memroy(BGA153-0.5-TP)

Item #: 43938855

ETB 15165

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What Stands Out

Precision Design
Engineered for exact fit, this socket accommodates BGA153 packages seamlessly, ensuring optimal contact and reliable performance during burn-in testing for eMMC memory devices.
Non-Soldering Setup
Utilizes screw fixation, eliminating the need for soldering. This feature facilitates quick setup and enhances reusable capabilities, saving time and reducing waste in testing processes.
Robust Compatibility
Specifically designed for 0.5mm pitch IC sizes, this socket is suitable for various applications, providing flexibility for manufacturers dealing with diverse eMMC and memory technologies.

Product Details

Shop online for the ALLSOCKET FBGA153 BGA153-0.5mm Burn-in Testing Socket Non-Soldering Version at Ubuy Ethiopia. Compatible with IC Size 11.5x13mm eMMC153-0.5mm MemroyBGA153-0.5-TP.
Item Weight1.5 lbs (680 grams)

Who Should Buy?

Suitable For
  • Engineers & Technicians

    Ideal for professionals needing reliable burn-in testing solutions for eMMC memory chip interfaces.

  • Testing Facilities

    Great for testing labs focused on quality assurance and reliability testing of semiconductor devices.

  • Manufacturers

    Suitable for memory manufacturers requiring non-soldering solutions to enhance assembly flexibility and reduce production costs.

Not Suitable For
  • Hobbyists

    Not suitable for casual users or hobbyists lacking advanced soldering experience and equipment for professional testing.

  • Low Volume Production

    May not be cost-effective for low volume productions due to the high setup time and complexity involved.

  • Non-Technical Users

    Users without technical skills in electronics may struggle to utilize this socket effectively for testing purposes.

Product Description

FBGA153 BGA153-0.5mm Burn-in Testing Socket Non-Soldering Version(Fix by Screw), Pitch 0.5mm IC Size 11.5x13mm eMMC153-0.5mm Memroy(BGA153-0.5-TP)

About This Item

Introducing the ALLSOCKET FBGA153 BGA153-0.5mm Burn-in Testing Socket, the ultimate solution for non-soldering testing of ICs with a pitch of 0.5mm and a size of 11.5x13mm. This socket is specifically designed for eMMC153-0.5mm memory modules, ensuring perfect compatibility and reliable performance. With its innovative screw-fixing design, this socket provides a secure and stable connection, eliminating the need for soldering and reducing the risk of damage to the IC during testing. It is also easy to install and uninstall, making it a convenient choice for your testing needs. The ALLSOCKET FBGA153 BGA153-0.5mm Burn-in Testing Socket is not only compatible with BGA153-0.5mm ICs, but it is also designed to accommodate eMMC153-0.5mm memory modules.

This versatile socket allows for comprehensive testing and is ideal for a variety of applications. Whether you require a socket for burn-in testing, memory testing, or general IC testing, the ALLSOCKET FBGA153 BGA153-0.5mm Burn-in Testing Socket is a reliable and efficient choice. Its high-quality construction ensures durability and longevity, providing you with a long-lasting testing solution. Invest in the ALLSOCKET FBGA153 BGA153-0.5mm Burn-in Testing Socket and experience hassle-free testing of your ICs and memory modules. With its non-soldering design, pitch of 0.5mm, and compatibility with eMMC153-0.5mm modules, this socket is the perfect tool for your testing needs.

Have any Query? Chat with us

Customer Questions & Answers

  • Question: What are the key features of the FBGA153 BGA153-0.5mm Burn-in Testing Socket?

    Answer: The FBGA153 BGA153-0.5mm socket is designed for non-soldering applications, utilizing a screw-based fixation system. With a pitch of 0.5mm, it is perfectly suited for eMMC memory chips measuring 11.5x13mm. This socket allows for efficient burn-in testing and reliable connections without the need for soldering, making it ideal for prototyping and low-volume production. Its durable construction ensures longevity, while the precise specifications help maintain signal integrity during testing.
  • Question: How does the non-soldering feature benefit users?

    Answer: The non-soldering feature of the FBGA153 socket allows for quick and easy installation and removal of components. This is beneficial for engineers who need to test and prototype multiple chips without the time-consuming process of soldering. It reduces the risk of damaging components, thereby ensuring a higher reuse rate. For instance, it can be used in research and development environments where different configurations are frequently tested.
  • Question: What applications are suitable for the FBGA153 socket?

    Answer: The FBGA153 socket is mainly used in burn-in testing of eMMC memory chips. It's ideal for testing devices like smartphones, tablets, and embedded systems that utilize eMMC storage. Because of its non-soldering feature, it's especially useful for test engineers who frequently switch out ICs during development. This flexibility makes it a perfect choice for both laboratory settings and manufacturing environments where speed is essential.
  • Question: What is the significance of the 0.5mm pitch specification?

    Answer: The 0.5mm pitch specification is critical as it defines the distance between the pins of the IC being tested. This precise measurement ensures that the socket establishes reliable connections with the corresponding pads on the IC. A proper match in pitch is crucial for maintaining signal quality, preventing short circuits, and ensuring successful testing outcomes, especially in high-density applications where space is limited.
  • Question: Can I use the FBGA153 socket with different IC sizes?

    Answer: The FBGA153 BGA153-0.5mm socket is specifically designed for ICs sized at 11.5x13mm, and using it with ICs of different sizes may lead to improper fittings and unreliable testing results. It's crucial to ensure compatibility both in size and pin pitch to maintain integrity during testing. This specialization improves efficiency and accuracy in your burn-in tests, ensuring valid results before integrating into final products.
  • Question: Does the FBGA153 socket provide any protection to the IC during testing?

    Answer: Yes, the FBGA153 socket is designed to provide a snug, stable connection that protects the IC during burn-in testing. The non-soldering installation minimizes the risk of thermal damage caused by soldering processes, ensuring that the IC maintains its integrity during high-stress testing conditions. This protection is essential in preserving the lifespan of the IC and yielding reliable test results, a must in quality assurance processes.
  • Question: What tools are required to install the FBGA153 testing socket?

    Answer: Installation of the FBGA153 socket generally requires basic tools such as a screwdriver for the screw-based fixation system. Additionally, users may need a magnifying glass or microscope for precise alignment during installation, especially due to the small dimensions and the 0.5mm pitch. This setup contributes to a seamless testing process where accurate contact is essential, particularly in high-density IC applications.
  • Question: Is the FBGA153 socket reusable?

    Answer: Yes, the FBGA153 socket is designed for multiple uses without significant wear. Its non-soldering, screw-based fixing mechanism ensures that ICs can be repeatedly installed and removed without damaging the socket or the chips themselves. This makes it a valuable tool in environments where ICs undergo numerous tests, thereby maximizing the utility of each socket across various projects or test scenarios.
  • Question: Where can I buy the FBGA153 BGA153-0.5mm testing socket in the Ethiopia?

    Answer: You can purchase the FBGA153 BGA153-0.5mm Burn-in Testing Socket from Ubuy, a trusted online platform known for providing a wide range of electronic components. Ubuy offers reliable shipping options and customer service support, ensuring you can conveniently acquire the socket and have it delivered directly to your location in the Ethiopia. Their user-friendly interface and varied payment options also enhance your shopping experience.

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ETB 15165

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